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n-channel enhancement mode mosfet copyright ? anpec electronics corp. rev. a.3 - nov., 2003 www.anpec.com.tw 1 apm2054n gd s 123 pin description ordering and marking information features applications ? switching regulators ? switching converters top view of to-252 absolute maximum ratings (t a = 25 c unless otherwise noted) ? 20v/12a, r ds(on) =35m ? (typ.) @ v gs =10v r ds(on) =45m ? (typ.) @ v gs =4.5v r ds(on) =110m ? (typ.) @ v gs =2.5v ? ? ? ? ? super high dense cell design ? ? ? ? ? high power and current handling capability ? ? ? ? ? to-252, sot-89 and sot-223 packages package c ode d : so t-89 v : so t-223 u : to -252 o peration junction tem p. range c : -55 to 150 c handling c ode tr : tape & reel lead feed code l : lead free d evice blank : o riginal device apm 2054n handling c ode package c ode apm 2054n xxxxx apm 2054n d /v : xxxxx - date code apm 2054n xxxxx apm 2054n u : xxxxx - date code tem p range package c ode lead free code s d g 123 top view of sot-223 gd s 123 top view of sot-89 n-channel mosfet g s d anpec reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. symbol parameter rating unit v dss drain-source voltage 20 v gss gate-source voltage 16 v to-252 10 i d * maximum drain current ? continuous sot-223/sot-89 4 to-252 25 i dm maximum drain current ? pulsed sot-223/sot-89 12 a p d * maximum power dissipation t a =25c to-252 5 w
copyright ? anpec electronics corp. rev. a.3 - nov., 2003 www.anpec.com.tw 2 apm2054n absolute maximum ratings (t a = 25 c unless otherwise noted) symbol parameter rating unit t a =25c sot-223/sot-89 1.25 to-252 2 p d * maximum power dissipation t a =100c sot-223/sot-89 0.5 w t j maximum junction temperature 150 c t stg storage temperature range -55 to 150 c * surface mounted on fr4 board, t 10 sec. electrical characteristics (t a =25c unless otherwise noted) notes a : pulse test ; pulse width 300 s, duty cycle 2 % b : guaranteed by design, not subject to production testing apm2054n symbol parameter test condition min. typ. max. unit static bv dss drain-source breakdown voltage v gs =0v, i ds =250 a 20 v i dss zero gate voltage drain current v ds =16v, v gs =0v 1 a v gs(th) gate threshold voltage v ds =v gs , i ds =250 a 0.7 0.9 1.5 v i gss gate leakage current v gs = 16v, v ds =0v 100 na v gs =10v, i ds =12a 35 40 v gs =4.5v, i ds =6a 45 54 r ds(on) drain-source on-state resistance v gs =2.5v, i ds =2a 110 130 m ? v sd diode forward voltage i sd =6a, v gs =0v 0.7 1.3 v dynamic q g total gate charge 11 13 q gs gate-source charge 3.8 q gd gate-drain charge v ds =10v, v gs =4.5v, i ds =6a 5.2 nc t d(on) turn-on delay time 12 24 t r turn-on rise time 10 20 t d(off) turn-off delay time 40 74 t f turn-off fall time v dd =10v, i ds =1a, v gen =4.5v, r g =6 ? 20 38 ns c iss input capacitance 450 c oss output capacitance 100 c rss reverse transfer capacitance v gs =0v v ds =15v frequency=1.0mhz 60 pf
copyright ? anpec electronics corp. rev. a.3 - nov., 2003 www.anpec.com.tw 3 apm2054n typical characteristics i d- drain current (a) transfer characteristics v gs - gate-to-source voltage (v) -50 -25 0 25 50 75 100 125 150 0.00 0.25 0.50 0.75 1.00 1.25 1.50 threshold voltage vs. temperature tj - junction temperature (c) v gs(th)- threshold voltage (v) (normalized) i ds =250ua r ds(on) -on-resistance ( ? ) on-resistance vs. drain current i d - drain current (a) v ds - drain-to-source voltage (v) output characteristics i d -drain current (a) 0246810 0 3 6 9 12 v gs =2v v gs =3v v gs = 4, 5, 6, 7, 8, 9, 10v 012345 0 3 6 9 12 t j =125 o c t j =25 o c t j =-55 o c 0246810 0.01 0.02 0.03 0.04 0.05 0.06 0.07 v gs =4.5v v gs =10v
copyright ? anpec electronics corp. rev. a.3 - nov., 2003 www.anpec.com.tw 4 apm2054n 0 5 10 15 20 25 0 2 4 6 8 10 typical characteristics -50 -25 0 25 50 75 100 125 150 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 r ds(on) -on-resistance ( ? ) (normalized) on-resistance vs. junction temperature v gs =10v i d =12a t j - junction temperature (c) gate charge q g -total gate charge (nc) v gs -gate-source voltage (v) v ds =10v i d =6a -50 -25 0 25 50 75 100 125 150 0.00 0.01 0.02 0.03 0.04 0.05 0.06 0.07 r ds(on) -on-resistance ( ? ) on-resistance vs. junction temperature v gs =10v i d =12a t j - junction temperature (c) v gs - gate-to-source voltage (v) r ds(on) -on-resistance ( ? ) on-resistance vs. gate-to-source voltage 0246810 0.00 0.02 0.04 0.06 0.08 0.10 i d = 6a
copyright ? anpec electronics corp. rev. a.3 - nov., 2003 www.anpec.com.tw 5 apm2054n power (w) single pulse power time (sec) typical characteristics 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 1 10 12 source-drain diode forward voltage i s -source current (a) t j =150c t j =25c v sd -source-to-drain voltage (v) 0 5 10 15 20 0 125 250 375 500 625 750 crss coss ciss v ds - drain-to-source voltage (v) capacitance capacitance (pf) power (w) single pulse power time (sec) to-252 sot-223/89 frequency=1mhz 1e-4 1e-3 0.01 0.1 1 10 100 0 30 60 90 120 150 300 1e-4 1e-3 0.01 0.1 1 10 100 0 70 140 210 280 350 300
copyright ? anpec electronics corp. rev. a.3 - nov., 2003 www.anpec.com.tw 6 apm2054n typical characteristics square wave pulse duration (sec) normalized effective transient thermal impedance normalized thermal transient impedence, junction to ambient square wave pulse duration (sec) normalized effective transient thermal impedance normalized thermal transient impedence, junction to ambient to-252 sot-223/89 1e-4 1e-3 0.01 0.1 1 10 100 300 1e-3 0.01 0.1 1 2 d=0.02 d=0.05 d=0.1 d=0.2 duty cycle=0.5 single pulse 1.duty cycle, d= t1/t2 2.per unit base=r thja =100 o c/w 3.t jm -t a =p dm z thja 4.surface mounted 1e-4 1e-3 0.01 0.1 1 10 100 300 1e-3 0.01 0.1 1 2 d=0.02 d=0.05 d=0.1 d=0.2 duty cycle=0.5 single pulse 1.duty cycle, d= t1/t2 2.per unit base=r thja =50 o c/w 3.t jm -t a =p dm z thja 4.surface mounted
copyright ? anpec electronics corp. rev. a.3 - nov., 2003 www.anpec.com.tw 7 apm2054n package information to-252( reference jedec registration to-252) millimeters inches dim min. max. min. max. a 2.18 2.39 0.086 0.094 a1 0.89 1.27 0.035 0.050 b 0.508 0.89 0.020 0.035 b2 5.207 5.461 0.205 0.215 c 0.46 0.58 0.018 0.023 c1 0.46 0.58 0.018 0.023 d 5.334 6.22 0.210 0.245 e 6.35 6.73 0.250 0.265 e1 3.96 5.18 0.156 0.204 h 9.398 10.41 0.370 0.410 l 0.51 0.020 l1 0.64 1.02 0.025 0.040 l2 0.89 2.032 0.035 0.080 l2 d l1 b b2 e c1 a h l c a1 e1
copyright ? anpec electronics corp. rev. a.3 - nov., 2003 www.anpec.com.tw 8 apm2054n package information d d1 e b1 e1 b 12 3 l h e c a a a sot-89 (reference eiaj ed-7500a reg stration sc-62) millimeters inches dim min. max. min. max. a 1.40 1.60 0.055 0.063 b 0.40 0.56 0.016 0.022 b1 0.35 0.48 0.014 0.019 c 0.35 0.44 0.014 0.017 d 4.40 4.60 0.173 0.181 d1 1.35 1.83 0.053 0.072 e 1.50 bsc 0.059 bsc e1 3.00 bsc 0.118 bsc e 2.29 2.60 0.090 0.102 h 3.75 4.25 0.148 0.167 l 0.80 1.20 0.031 0.047 10 10
copyright ? anpec electronics corp. rev. a.3 - nov., 2003 www.anpec.com.tw 9 apm2054n package information sot-223( reference jedec registration sot-223) b1 d h e k e e1 a c l a1 a b b millimeters inches dim min. max. min. max. a 1.50 1.80 0.06 0.07 a1 0.02 0.08 b 0.60 0.80 0.02 0.03 b1 2.90 3.10 0.11 0.12 c 0.28 0.32 0.01 0.01 d 6.30 6.70 0.25 0.26 e 3.30 3.70 0.13 0.15 e 2.3 bsc 0.09 bsc e1 4.6 bsc 0.18 bsc h 6.70 7.30 0.26 0.29 l 0.91 1.10 0.04 0.04 k 1.50 2.00 0.06 0.08 0 10 0 10 13 13
copyright ? anpec electronics corp. rev. a.3 - nov., 2003 www.anpec.com.tw 10 apm2054n terminal material solder-plated copper (solder material : 90/10 or 63/37 snpb) lead solderability meets eia specification rsi86-91, ansi/j-std-002 category 3. reflow condition (ir/convection or vpr reflow) physical specifications pre-heat temperature 183 c peak temperature time temperature classification reflow profiles convection or ir/ convection vpr average ramp-up rate(183 c to peak) 3 c/second max. 10 c /second max. preheat temperature 125 25 c) 120 seconds max temperature maintained above 183 c 60 ? 150 seconds time within 5 c of actual peak temperature 10 ?20 seconds 60 seconds peak temperature range 220 +5/-0 c or 235 +5/-0 c 215-219 c or 235 +5/-0 c ramp-down rate 6 c /second max. 10 c /second max. time 25 c to peak temperature 6 minutes max. package reflow conditions pkg. thickness 2.5mm and all bgas pkg. thickness < 2.5mm and pkg. volume 350 mm3 pkg. thickness < 2.5mm and pkg. volume < 350mm3 convection 220 +5/-0 c convection 235 +5/-0 c vpr 215-219 c vpr 235 +5/-0 c ir/convection 220 +5/-0 c ir/convection 235 +5/-0 c
copyright ? anpec electronics corp. rev. a.3 - nov., 2003 www.anpec.com.tw 11 apm2054n classificatin reflow profiles profile feature sn-pb eutectic assembly pb-free assembly large body small body large body small body average ramp-up rate (t l to t p ) 3 c/second max. 3 c/second max. preheat temperature min (tsmin) temperature mix (tsmax) time (min to max)(ts) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds tsmax to t l temperature(t l ) time (t l ) 3 c/second max peak temperature(tp) 183 c 60-150 seconds 217 c 60-150 seconds time within 5 c of actual peak temperature(tp) 225 +0/-5 c 240 +0/-5 c 245 +0/-5 c 250 +0/-5 c ramp-down rate 10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds time 25 c to peak temperature 6 c/second max. 6 c/second max. 6 minutes max. 8 minutes max. note: all temperatures refer to topside of the package. measured on the body surface. reflow condition (ir/convection or vpr reflow) t 25 c to peak tp ramp-up t l ramp-down ts preheat tsmax tsmin t l t p 25 temperature time critical zone t l to t p
copyright ? anpec electronics corp. rev. a.3 - nov., 2003 www.anpec.com.tw 12 apm2054n carrier tape & reel dimensions a j b t2 t1 c t ao e w po p ko bo d1 d f p1 test item method description solderability mil-std-883d-2003 245c,5 sec holt mil-std 883d-1005.7 1000 hrs bias @ 125c pct jesd-22-b, a102 168 hrs, 100% rh, 121c tst mil-std 883d-1011.9 -65c ~ 150c, 200 cycles reliability test program
copyright ? anpec electronics corp. rev. a.3 - nov., 2003 www.anpec.com.tw 13 apm2054n a pp lication a b c j t1 t2 w p e 330 3100 213 0. 5 2 0.5 16.4 + 0.3 -0.2 2.5 0.5 16+ 0.3 - 0.1 8 0.1 1.75 0.1 f d d1 po p1 ao bo ko t to-252 7.5 0.1 1.5 +0.1 1.5 0.25 4.0 0.1 2.0 0.1 6.8 0.1 10.4 0.1 2.5 0.1 0.3 0.05 a pp lication a b c j t1 t2 w p e 178 170 213.5 0.15 3 0.15 14 2 1.3 0.3 12 + 0.3 12 - 0.1 8 0.1 1.75 0.1 f d d1 po p1 ao bo ko t sot-89 5.5 0.05 1.5 0.1 1.5 0.1 4.0 0.1 2.0 0.1 4.8 0.1 4.5 0.1 1.80 0.1 0.3 0.013 a pp lication a b c j t1 t2 w p e 330 162 1.5 12.75 0.15 2 0.6 12.4 +0.2 2 0.2 12 0.3 8 0.1 1.75 0.1 f d d1 po p1 ao bo ko t sot-223 5.5 0.05 1.5+ 0.1 1.5+ 0.1 4.0 0.1 2.0 0.05 6.9 0.1 7.5 0.1 2.1 0.1 0.3 0.05 application carrier width cover tape width devices per reel sot- 89 12 9.3 1000 sot- 223 12 9.3 2500 to- 252 16 13.3 2500 customer service anpec electronics corp. head office : 5f, no. 2 li-hsin road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 taipei branch : 7f, no. 137, lane 235, pac chiao rd., hsin tien city, taipei hsien, taiwan, r. o. c. tel : 886-2-89191368 fax : 886-2-89191369 cover tape dimensions

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